Abstract :
The following topics are dealt with: advanced packaging; system integration; packaging materials-processes; packaging design-modeling; high-density substrate; advanced manufacturing technologies; packaging equipment; quality-reliability; and solid state lighting packaging-integration.
Keywords :
packaging; reliability; advanced manufacturing technologies; advanced packaging; high-density substrate; packaging design; packaging equipment; packaging materials; packaging modeling; packaging processes; quality-reliability; solid state lighting packaging-integration; system integration;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066919
