Title :
Solder prefrom application
Author :
Yu, Hu ; Ming, Shen ; Gong, Angela ; Lu, Alan
Author_Institution :
Electron. Assembly Processes & Mater., Siemens Ltd., China
Abstract :
Solder preforms are generally made from solder alloy wire or stamped from solder alloy sheet material, produced in large quantities with tight tolerance. It´s almost no limitation in shapes, sizes and alloy-composition. In this work, different solder preforms in shape and volume were used to supplement additional solder volume in several different component packages. The fill rate, void and formation of intermetallic compounds (IMC) were investigated by optical microscope, X-ray and cross section. It was found that solder preform is good option to provide extra solder material with low cost and high quality on miniaturization and complication PCBa assembly.
Keywords :
X-ray microscopy; electronics packaging; optical microscopes; printed circuits; solders; PCB assembly; X-ray microscope; component packages; intermetallic compounds; optical microscope; solder alloy sheet material; solder alloy wire; solder preform application; Connectors; Electronics packaging; Materials; Metals; Preforms; Shape; Soldering;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066925
