Study on the heat dissipation of the thermal via in T/R modules based on BP-GA

Author

Bi, Tang-wen ; Zhou, De-jian

Author_Institution

Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

3

Abstract

Thermal via which widely is used in chips and the PCB is a strong way to transfer heat. But at the same time, Thermal via settings take up assembly space, so the parameters of thermal via must be optimized. This paper makes the predictive value as the fitness value, use the BP-GA hybrid algorithm, through optimizing the number, pitch and diameter, to get the lowest chip junction temperature. It is concluded that the junction temperature of T/R modules chip change from 54.206°C to 52.097°C by adding thermal via Settings. The temperature is reduced 2.109°C. It shows that thermal via Settings effectively lower the junction temperature of the chips, improving device´s using life. This paper contributes guiding significance on thermal design of the T/R modules.

Keywords

backpropagation; circuit analysis computing; cooling; genetic algorithms; modules; printed circuits; thermal analysis; BP-GA hybrid algorithm; PCB; T/R modules; chip junction temperature; temperature 54.206 degC to 52.097 degC; thermal design; thermal via heat dissipation; thermal via settings; Electronic packaging thermal management; Junctions; Optimization; Resistance heating; Thermal analysis; Thermal conductivity; T/R modules; genetic algorithm; neural network; thermal via;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066926

Filename

6066926