• DocumentCode
    2185951
  • Title

    A new measurement method and electrical design for high density optoelectronics integration

  • Author

    Liu, Fengman ; Li, Baoxia ; Zhou, Yunyan ; Gao, Wei ; Xiang, Haifei ; Wang, Haidong ; Song, Jian ; Li, Zhihua ; Yang, Kun ; Li, Jun ; Cao, Liqiang ; Wan, Lixi

  • Author_Institution
    Inst. of Microelectron., Beijing, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper describes a parallel test method based on a cross-point switch which can be programmed to control signal path and the number of switches to be opened according to the number of channels to be tested. In this method, at the transmitting side, one source inputted cross-point switch can be fan-out to multi sources to activate device under test, and different signal trace or length of cables can change phases between multi sources. At the receiving side, all output channels are connected to another RF switch controlled to choose output channel. These two switches both are controlled by software. Multi channels working together will help evaluating cross talk between channels and SSN noise test. In this paper, to ensure test accuracy, signal integrity of DUT and test system is designed and simulated. And an 8-channel optical transceiver is tested using this method and cross talk and power noise are especially showed and analyzed. The test results indicate this test method can meet parallel optical transmission test requirement and other optical module and electrical module test; however the cost is greatly lower than high speed test instruments.
  • Keywords
    electronics packaging; integrated optoelectronics; optical transceivers; 8-channel optical transceiver; RF switch; SSN noise test; cross-point switch; device under test; electrical design; high density optoelectronics integration; parallel optical transmission test requirement; parallel test method; power noise; signal integrity; signal path; Adaptive optics; High speed optical techniques; Integrated optics; Noise; Optical switches; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066929
  • Filename
    6066929