Laser bonding system for semiconductor device and MEMS encapsulation

A semi-automatic laser bonding system is developed to provide a localized heating manner for semiconductor device and MEMS encapsulation, especially for devices which have thermal-sensitive materials inside. This system consists of five modules, including laser module, motion module, fixture module, monitoring module and control module. Several bonding tests are carried out using this system with different sets of system parameters, including laser power, laser beam radius and laser moving velocity. Good bonding results are achieved with proper combinations of the system parameters, which also certifies this system is workable.