Title :
Laser bonding system for semiconductor device and MEMS encapsulation
Author :
Huang, Yuanhao ; Li, Maoyu ; Lai, Yuneng ; Zunmiao Chen ; Zhang, Jianhua
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
Abstract :
A semi-automatic laser bonding system is developed to provide a localized heating manner for semiconductor device and MEMS encapsulation, especially for devices which have thermal-sensitive materials inside. This system consists of five modules, including laser module, motion module, fixture module, monitoring module and control module. Several bonding tests are carried out using this system with different sets of system parameters, including laser power, laser beam radius and laser moving velocity. Good bonding results are achieved with proper combinations of the system parameters, which also certifies this system is workable.
Keywords :
bonding processes; encapsulation; laser materials processing; micromechanical devices; semiconductor devices; MEMS encapsulation; bonding tests; control module; fixture module; heating manner; laser beam radius; laser module; laser moving velocity; laser power; monitoring module; motion module; semiautomatic laser bonding system; semiconductor device; thermal-sensitive materials; Bonding; Encapsulation; Glass; Laser beams; Laser modes; Power lasers; Semiconductor lasers;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066938
