• DocumentCode
    2186294
  • Title

    Study of GaN-based light-emitting diodes with double roughened surfaces

  • Author

    Yang, Lianqiao ; Hu, Jianzheng ; Zhang, Jianhua

  • Author_Institution
    Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In this paper, GaN-based blue light emitting diodes with double roughened surfaces were fabricated and compared with planar LEDs and these with single roughened layer. The double roughened surfaces were fulfilled by patterned sapphire substrates (PSS) and roughened p-GaN surface. Magnesium treatment during the growth process was used to produce p-GaN surface roughening. After the epitaxial growth, the four group samples were fabricated using the standard process (four mask steps) with a mesa area of 10×23 mil2. At last, 25 LED devices were packaged for each group using the same packaging material and by the same method. It was found that import of PSS and roughened p-GaN surface may lead to a little higher voltage by simply copying the epitaxial process of planar LED. However, even fabricated by the non-optimized epitaxial process, comparing with planar LEDs, the optical power of the package can be increased by 40.1% by using the patterned sapphire substrate, 10.2% by using p-GaN surface roughing, and 44.9% by using double roughing technologies.
  • Keywords
    III-V semiconductors; electronics packaging; epitaxial growth; gallium compounds; light emitting diodes; semiconductor growth; surface roughness; wide band gap semiconductors; GaN; LED device packaging; PSS; double-roughened surfaces; epitaxial growth; four-mask steps; gallium nitride-based light emitting diodes; magnesium treatment; p-gallium nitride surface roughening; packaging material; patterned sapphire substrates; planar LED; Gallium nitride; Light emitting diodes; Optical device fabrication; Rough surfaces; Substrates; Surface roughness; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066940
  • Filename
    6066940