DocumentCode :
2186294
Title :
Study of GaN-based light-emitting diodes with double roughened surfaces
Author :
Yang, Lianqiao ; Hu, Jianzheng ; Zhang, Jianhua
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
3
Abstract :
In this paper, GaN-based blue light emitting diodes with double roughened surfaces were fabricated and compared with planar LEDs and these with single roughened layer. The double roughened surfaces were fulfilled by patterned sapphire substrates (PSS) and roughened p-GaN surface. Magnesium treatment during the growth process was used to produce p-GaN surface roughening. After the epitaxial growth, the four group samples were fabricated using the standard process (four mask steps) with a mesa area of 10×23 mil2. At last, 25 LED devices were packaged for each group using the same packaging material and by the same method. It was found that import of PSS and roughened p-GaN surface may lead to a little higher voltage by simply copying the epitaxial process of planar LED. However, even fabricated by the non-optimized epitaxial process, comparing with planar LEDs, the optical power of the package can be increased by 40.1% by using the patterned sapphire substrate, 10.2% by using p-GaN surface roughing, and 44.9% by using double roughing technologies.
Keywords :
III-V semiconductors; electronics packaging; epitaxial growth; gallium compounds; light emitting diodes; semiconductor growth; surface roughness; wide band gap semiconductors; GaN; LED device packaging; PSS; double-roughened surfaces; epitaxial growth; four-mask steps; gallium nitride-based light emitting diodes; magnesium treatment; p-gallium nitride surface roughening; packaging material; patterned sapphire substrates; planar LED; Gallium nitride; Light emitting diodes; Optical device fabrication; Rough surfaces; Substrates; Surface roughness; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066940
Filename :
6066940
Link To Document :
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