DocumentCode
2186356
Title
Development of epoxy potting for high voltage insulation at SLAC
Author
Gross, G. ; Cassel, R. ; Mattison, T.
Author_Institution
SLAC, Stanford, CA, USA
fYear
1991
fDate
6-9 May 1991
Firstpage
2334
Abstract
An extensive series of tests has been done at SLAC (Stanford Linear Accelerator Center) to evaluate several loaded epoxy formulations for high-voltage potting applications. Mixing, degassing, transfer, cure, shrinkage, bubble and void formation, bond strength, and thermal cycles resistance were studied in a variety of mold types. Recommendations are presented for several classes of applications.<>
Keywords
linear accelerators; SLAC; bond strength; bubble; cure; degassing; epoxy potting; high voltage insulation; loaded epoxy formulations; mixing; mold types; shrinkage; thermal cycles resistance; transfer; void formation; Aluminum; Bonding; Casting; Epoxy resins; Insulation; Magnetic separation; Surface resistance; Testing; Thermal resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Particle Accelerator Conference, 1991. Accelerator Science and Technology., Conference Record of the 1991 IEEE
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-0135-8
Type
conf
DOI
10.1109/PAC.1991.164957
Filename
164957
Link To Document