DocumentCode :
2186360
Title :
Channel quality comparison for OOGIO bus designs
Author :
Li, Y.L. ; Ye, Xiaoning ; Xia, Kai ; Su, Thonas ; Kang, Karen
Author_Institution :
Intel Corp., Taipei, Taiwan
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
3
Abstract :
Traditionally, Intel supports ODM/OEM (original design manufacturer / original equipment manufacturer) IO bus designs via PDG (platform design guide). If IO bus design is out of PDG guidelines (OOG), usually Intel cannot support it. However, Intel is experiencing overwhelming customer requests for OOG support since more and more customers are designing products OOG for cost vs. performance trade-off. On the other hand, OEMs/ODMs usually have very stringent schedules and limited SI resources, and it is not practical for them to follow Intel´s internal complicated SI simulation process for a robust platform design. Therefore, we propose a simple but very accurate and powerful approach, channel quality comparison (CQC), to address this problem. CQC can significantly improve Intel OOG support quality and enable OEMs/ODMs to support all OOG designs. CQC also helps them to optimize PCB Design BOM cost vs. performance and reduce product development cycle for time-to-market (TTM).
Keywords :
design for quality; electronic equipment manufacture; printed circuit design; product design; system buses; Intel; ODM-OEM IO bus designs; OOG IO bus designs; PCB design BOM cost; SI simulation process; channel quality comparison; original design manufacturer; original equipment manufacturer; platform design guide; product development cycle; time-to-market; Accuracy; Analytical models; Bit error rate; Frequency domain analysis; Scattering parameters; Silicon; US Department of Energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066943
Filename :
6066943
Link To Document :
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