• DocumentCode
    2186360
  • Title

    Channel quality comparison for OOGIO bus designs

  • Author

    Li, Y.L. ; Ye, Xiaoning ; Xia, Kai ; Su, Thonas ; Kang, Karen

  • Author_Institution
    Intel Corp., Taipei, Taiwan
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Traditionally, Intel supports ODM/OEM (original design manufacturer / original equipment manufacturer) IO bus designs via PDG (platform design guide). If IO bus design is out of PDG guidelines (OOG), usually Intel cannot support it. However, Intel is experiencing overwhelming customer requests for OOG support since more and more customers are designing products OOG for cost vs. performance trade-off. On the other hand, OEMs/ODMs usually have very stringent schedules and limited SI resources, and it is not practical for them to follow Intel´s internal complicated SI simulation process for a robust platform design. Therefore, we propose a simple but very accurate and powerful approach, channel quality comparison (CQC), to address this problem. CQC can significantly improve Intel OOG support quality and enable OEMs/ODMs to support all OOG designs. CQC also helps them to optimize PCB Design BOM cost vs. performance and reduce product development cycle for time-to-market (TTM).
  • Keywords
    design for quality; electronic equipment manufacture; printed circuit design; product design; system buses; Intel; ODM-OEM IO bus designs; OOG IO bus designs; PCB design BOM cost; SI simulation process; channel quality comparison; original design manufacturer; original equipment manufacturer; platform design guide; product development cycle; time-to-market; Accuracy; Analytical models; Bit error rate; Frequency domain analysis; Scattering parameters; Silicon; US Department of Energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066943
  • Filename
    6066943