Title :
The stress-strain behaviors of solder joints during thermal fatigue process
Author :
Zhiting, Geng ; He Qing ; Guohai, Cheng ; Jusheng, Ma
Author_Institution :
Sch. of Energy & Power Eng., North China Electr. Power Univ., Beijing, China
Abstract :
By means of establishing experimental model, the mechanical behavior and changes in basic parameters of new Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and using the result to evaluate the performance of this new type of lead-free solder, providing the accurate boundary conditions for the reliability estimation methods (finite element analysis) of solder. This study of solder joint reliability and life assessment in thermal fatigue process has very important theoretical and practical significance.
Keywords :
electronics packaging; finite element analysis; reliability; soldering; solders; stress-strain relations; thermal stress cracking; Sn-Zn; boundary condition; finite element analysis; lead-free solder joint; life assessment; mechanical behavior; reliability estimation method; solder joint reliability; stress-strain behavior; thermal fatigue process; Copper; Fatigue; Lead; Soldering; Strain; Thermal stresses; lead-free solder; stress-strain; thermal fatigue;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066944
