DocumentCode :
2186524
Title :
3D Analysis of Complex Interconnects via Reduced-Order Modeling
Author :
Benel, J. ; Pichon, Lionel
fYear :
2007
fDate :
17-21 Sept. 2007
Firstpage :
860
Lastpage :
863
Abstract :
This paper presents a reduced-order modeling (ROM) applied on a 3D finite element model. It allows to obtain a time-domain reduced model which keeps the same behavior as the original one. To illustrate the methodology, the technique is applied to typical conducting tracks and cables.
Keywords :
cables (electric); finite element analysis; interconnections; reduced order systems; time-domain analysis; 3D analysis; 3D finite element model; complex interconnects; conducting cables; conducting tracks; reduced-order modeling; time-domain reduced model; Electromagnetic compatibility; Equations; Finite element methods; Integrated circuit interconnections; Linear systems; Mathematical model; Read only memory; Time domain analysis; Transfer functions; Wideband;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetics in Advanced Applications, 2007. ICEAA 2007. International Conference on
Conference_Location :
Torino
Print_ISBN :
978-1-4244-0767-5
Electronic_ISBN :
978-1-4244-0767-5
Type :
conf
DOI :
10.1109/ICEAA.2007.4387440
Filename :
4387440
Link To Document :
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