Title :
Die attach quality testing by fully contact-less measurement method
Author :
Bognar, G. ; Horvath, G. ; Szues, Z. ; Szekely, V.
Author_Institution :
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ.
Abstract :
The paper presents a novel, fully contact-less method for detecting die attach problems of semiconductor devices by measuring the dilatation resulting from thermal expansion. Laser interferometer measuring system was used to measure the thermal dilatation caused by infrared radiation directed onto the measured structure. By using the contact based stylus measurement method the previously got results have been cross-verified
Keywords :
light interferometry; microassembling; production testing; quality control; semiconductor device manufacture; contact-less measurement method; die attach problem detection; infrared radiation; laser interferometer measuring system; package void detection; quality testing; semiconductor devices; thermal dilatation; thermal expansion; Displacement measurement; Laser beams; Microassembly; Micromechanical devices; Mirrors; Optical retarders; Packaging; Polarization; Semiconductor device measurement; Testing;
Conference_Titel :
Design and Diagnostics of Electronic Circuits and systems, 2006 IEEE
Conference_Location :
Prague
Print_ISBN :
1-4244-0185-2
DOI :
10.1109/DDECS.2006.1649578
