Interconnect simulation based on passivity and method of characteristics

Author

Kuh, E.S. ; Mao, J.E. ; Wang, M.L.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

fYear

1996

fDate

18-21 Nov 1996

Firstpage

449

Lastpage

457

Abstract

Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging

Keywords

Laplace transforms; VLSI; circuit analysis computing; digital simulation; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; electronic packaging; interconnect simulation; method of characteristics; passivity; simulation methods; submicron IC; Analytical models; Computational modeling; Convolution; Delay; Integrated circuit interconnections; Integrated circuit modeling; Polynomials; Power transmission lines; Propagation losses; Stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1996., IEEE Asia Pacific Conference on

Conference_Location

Seoul

Print_ISBN

0-7803-3702-6

Type

conf

DOI

10.1109/APCAS.1996.569311

Filename

569311