SOP package surface discoloration after PCT test

Author

Wang, Mu-Chun ; Yang, Hsin-Chia ; Liu, Chuan-Hsi ; Yang, Ren-Hau

Author_Institution

Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

Keywords

integrated circuit packaging; integrated circuit reliability; integrated circuit testing; surface mount technology; IC products; PCT test; SOP package surface discoloration; assembly technology; dual side small outline package; metal migration; pressure cook test; product reliability test; reliability tests; surface mount package technology; Conferences; Electronic components; Electronics packaging; Integrated circuits; Materials; Packaging; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066964

Filename

6066964