DocumentCode
2187063
Title
Integrated free-space optical interconnects for chip-to-chip communications
Author
Jahns, Jürgen
Author_Institution
Opt. Nachrichtentech., Fern Univ., Hagen, Germany
fYear
1998
fDate
15-17 Jun 1998
Firstpage
20
Lastpage
23
Abstract
Free-space optics can help alleviate the communications problems of electronic computers by its large spatial and temporal bandwidth. For compact packaging, the concept of planar-integrated free-space optics is used. Here, we give an overview of the design, fabrication and thermal management of planar optical interconnects
Keywords
integrated circuit interconnections; multiprocessing systems; optical information processing; optical interconnections; parallel architectures; chip-to-chip communications; compact packaging; electronic computers; optical interconnects; planar optical interconnects; planar-integrated free-space optics; Bandwidth; Integrated optics; Optical arrays; Optical device fabrication; Optical interconnections; Optical waveguides; Packaging; Semiconductor laser arrays; Sensor arrays; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Massively Parallel Processing, 1998. Proceedings. Fifth International Conference on
Conference_Location
Las Vegas, NV
Print_ISBN
0-8186-8572-7
Type
conf
DOI
10.1109/MPPOI.1998.682122
Filename
682122
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