Title :
Reliability aanalysis on the solder joints in space cable connectors
Author :
Xiao-chao, Zhang ; Zhen-ming, Zhang ; Meng, Yang
Author_Institution :
Beijing Spacecrafts, Beijing, China
Abstract :
High reliability is prerequisite requirement for the solders in the space electronic products for its inconvenient in-orbit servicing. Based on the finite element method, the reliability of connector solder joints in cable out of a space craft is analyzed when the environment temperature varies in a large scale range within a day, in which the temperature may reach 120 °C in the daylight but decrease to -180 °C in the night with a transient rate of change upper 2 °C per min. The result is available for predict the fatigue life under the cyclic thermal load and developing programs about processing and accelerated environment test.
Keywords :
electric connectors; finite element analysis; reliability; solders; space vehicle electronics; accelerated environment test; cyclic thermal load; fatigue life; finite element method; reliability analysis; solder joints; space cable connectors; space craft; space electronic products; temperature 120 degC; temperature 180 degC; Connectors; Lead; Power cables; Reliability; Soldering; Stress; Thermal loading;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066973
