Experiments and numerical simulation on the performance of LED subjected to thermal shock

Author

Gui, Xulong ; Liu, Sheng

Author_Institution

Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

In this paper, in order to improve the reliability of LED module, the accelerated life test (ALT) for LED was conducted. Experimental measurements were adopted to obtain the temperature variations of LED module. In the experiment, the LED samples are placed in the chamber to conduct the thermal shock between -40°C and 125°C. The powered and unpowered experiments of LED were both tested. The luminous efficiency of LED was tested as a function of time. It was found that some LED samples failed. Numerical simulation was used to obtain the thermal stress distribution of the LED modules. Base on the above experiments and simulations, failure mechanisms were analyzed. The most vulnerable position of LEDs was pointed out.

Keywords

life testing; light emitting diodes; reliability; temperature measurement; thermal stresses; ALT; LED module reliability; accelerated life test; failure mechanism; luminous efficiency; temperature variation; thermal shock; thermal stress distribution; Electric shock; Electronic packaging thermal management; IEEE Lasers and Electro-Optics Society; Light emitting diodes; Stress; Temperature measurement; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066975

Filename

6066975