DocumentCode :
2187308
Title :
Experiments and numerical simulation on the performance of LED subjected to thermal shock
Author :
Gui, Xulong ; Liu, Sheng
Author_Institution :
Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, in order to improve the reliability of LED module, the accelerated life test (ALT) for LED was conducted. Experimental measurements were adopted to obtain the temperature variations of LED module. In the experiment, the LED samples are placed in the chamber to conduct the thermal shock between -40°C and 125°C. The powered and unpowered experiments of LED were both tested. The luminous efficiency of LED was tested as a function of time. It was found that some LED samples failed. Numerical simulation was used to obtain the thermal stress distribution of the LED modules. Base on the above experiments and simulations, failure mechanisms were analyzed. The most vulnerable position of LEDs was pointed out.
Keywords :
life testing; light emitting diodes; reliability; temperature measurement; thermal stresses; ALT; LED module reliability; accelerated life test; failure mechanism; luminous efficiency; temperature variation; thermal shock; thermal stress distribution; Electric shock; Electronic packaging thermal management; IEEE Lasers and Electro-Optics Society; Light emitting diodes; Stress; Temperature measurement; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6066975
Filename :
6066975
Link To Document :
بازگشت