Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions

Author

Gao, Yanfang ; Cheng, Congqian ; Huang, Mingliang ; Wang, Lihua ; Zhao, Jie

Author_Institution

Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

The corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl, l%NaCl-2%Na2S04 and l%NaCl-0.6%Na2SO4-3%Na2CO3 solutions were investigated using leaching test. The leaching of Sn from the solder in l%NaCl-0.6%Na2SO4-3%Na2CO3 solution was relatively serious, compared to that in the other two solutions. The amount of Sn leached from the joint was the largest in NaCl solution. Loosen corroded products formed on the surfaces of the solder or joint where a large amount of Sn leached. The XRD results showed that the corrosion products were mainly composed of SnO, Sn02 and Sn4(OH)6C12. The potentiodynamic polarization tests suggested that the galvanic corrosion which formed between solder alloys and Cu substrate was the main reason for the above differences.

Keywords

X-ray diffraction; copper alloys; corrosion testing; electronics packaging; leaching; solders; tin alloys; Cu; Sn-Cu-Cu; XRD; galvanic corrosion; leaching test; loosen corroded products; potentiodynamic polarization tests; solder alloys; solder joint corrosion; Copper; Corrosion; Joints; Leaching; Substrates; Tin; Corrosion; Joint; Leaching behavior; Salt solutions; Solder alloy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066979

Filename

6066979