Title :
Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions
Author :
Gao, Yanfang ; Cheng, Congqian ; Huang, Mingliang ; Wang, Lihua ; Zhao, Jie
Author_Institution :
Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China
Abstract :
The corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl, l%NaCl-2%Na2S04 and l%NaCl-0.6%Na2SO4-3%Na2CO3 solutions were investigated using leaching test. The leaching of Sn from the solder in l%NaCl-0.6%Na2SO4-3%Na2CO3 solution was relatively serious, compared to that in the other two solutions. The amount of Sn leached from the joint was the largest in NaCl solution. Loosen corroded products formed on the surfaces of the solder or joint where a large amount of Sn leached. The XRD results showed that the corrosion products were mainly composed of SnO, Sn02 and Sn4(OH)6C12. The potentiodynamic polarization tests suggested that the galvanic corrosion which formed between solder alloys and Cu substrate was the main reason for the above differences.
Keywords :
X-ray diffraction; copper alloys; corrosion testing; electronics packaging; leaching; solders; tin alloys; Cu; Sn-Cu-Cu; XRD; galvanic corrosion; leaching test; loosen corroded products; potentiodynamic polarization tests; solder alloys; solder joint corrosion; Copper; Corrosion; Joints; Leaching; Substrates; Tin; Corrosion; Joint; Leaching behavior; Salt solutions; Solder alloy;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066979
