• DocumentCode
    2187727
  • Title

    Crosstalk analysis and optimization of high-speed interconnections

  • Author

    Wang, Haidong ; Song, Jian ; Liu, Fengman ; Xiang, Haifei ; Gao, Wei ; Wan, Lixi

  • Author_Institution
    Inst. of Microelectron., Beijing, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Crosstalk noise has become a major performance inhibitor in high speed digital system. This is especially the case in package designs, connector assemblies and circuit interconnects designs. With the simultaneous miniaturization of electronic systems and decreasing signal rise time, it is important to be able to predict major sources of crosstalk and to stay within the cross-talk budget for high-speed interconnects interfaces. In this paper, first, we focus on analyzing the crosstalk mechanism. Second, based on simulation, we propose methods to minimize crosstalk.
  • Keywords
    integrated circuit design; integrated circuit interconnections; integrated circuit packaging; optimisation; circuit interconnects designs; connector assembly; cross-talk budget; crosstalk analysis; electronic systems; high speed digital system; high-speed interconnection optimization; high-speed interconnects interfaces; package designs; Couplings; Crosstalk; Dielectric constant; Integrated circuit interconnections; Integrated circuit modeling; Software; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6066989
  • Filename
    6066989