Sample preparation device for molding compound adhesion test

Moisture ingression in plastic packages generally occurs through delaminated interfaces between different materials. So the adhesion strength between molding compound and substrate is crucial to the plastic package reliability. In the present work, a sample preparation device was designed for molding compound adhesion test. A series of experiments has been done with this device. The results showed that the data obtained with this device was stable. The data fluctuation was relatively small. The sample preparation device was effective in molding compound adhesion test.