Title :
Efficient heterogeneous three-dimensional packaging at a system level
Author_Institution :
Philips Lab., Briarcliff Manor, NY, USA
Abstract :
While a proliferation of approaches have been proposed for three-dimensional packaging, a basic dichotimization between short stacks of regular (low-complexity) iterated assemblies and heterogeneous approaches exist. For the latter, no clear order exists, which has stifled the true acceptance of three-dimensional packaging. Barriers to advancement of heterogeneous are discussed. Two basic approaches are examined
Keywords :
integrated circuit packaging; multichip modules; 3D MCM; dichotimization; digital avionics; heterogeneous approaches; heterogeneous three-dimensional packaging; iterated assemblies; memory stacks; multiple MCM; three-dimensional packaging; Assembly systems; Electronic packaging thermal management; Electronics packaging; Energy management; Laboratories; Missiles; Space technology; Space vehicles; Thermal management; Wiring;
Conference_Titel :
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-4150-3
DOI :
10.1109/DASC.1997.635038