DocumentCode :
2188840
Title :
Study on the reliability of high-power LEDs under temperature cycle
Author :
Huang, Fan ; Yin, Luqiao ; Li, Shuzhi ; Xu, Guangming ; Yan, Huafeng ; Chen, Yu ; Yang, Lianqiao ; Zhang, Jianhua
Author_Institution :
Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
4
Abstract :
High-power LEDs have been widely used and have a big potential market due to the many advantages compared to conventional light sources. Reliability is one of the most important issues for the application of LEDs. In order to study the degradation mechanism and the stability of LED withstanding cyclical exposures to temperature variations, life test was carried out under temperature cycle testing. The experiment was designed basing on the EIAJ ED-4701/100. Four groups of 1 W high power LEDs adopting different material and structures were utilized. The temperature cycle accelerated life test under the condition of -25°C/125°C. After the accelerated test, the optical performance of the four kinds of devices were compared and analyzed, and the thermal performance of the LEDs was also tested, analyzed and discussed. At last, the reliability differences of high-power LEDs were analyzed and degradation mechanism of high power LEDs under temperature cycling was discussed.
Keywords :
life testing; light emitting diodes; light sources; reliability; high-power LED reliability; light source; power 1 W; temperature -25 degC; temperature 125 degC; temperature cycle accelerated life test; Degradation; Electronic packaging thermal management; Junctions; Life estimation; Light emitting diodes; Reliability; Thermal analysis; High-power LEDs; degradation; optical performance; reliability; temperature cycle; thermal performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6067024
Filename :
6067024
Link To Document :
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