Title :
Designing a 100 MHz SPARC dual processor using MCM-L packaging technology and microwave design techniques
Author_Institution :
Mentor Graphics Corp., Wilsonville, OR, USA
Abstract :
This paper presents typical microwave design techniques applied to designing high speed MCMs for digital applications. Significantly improved MCM performance and reduced number of design iterations are achieved, by using these techniques. Further, a design of 100 MHz SPARC dual processor using MCM-L technology is presented, taking advantage of using unpackaged chips and design techniques frequently used in microwave designs.<>
Keywords :
design engineering; microprocessor chips; microwave integrated circuits; multichip modules; parallel architectures; reconfigurable architectures; 100 MHz; MCM-L packaging technology; SPARC dual processor; design iterations; digital applications; high speed MCMs; microwave design techniques; unpackaged chips; Microwave technology; Microwave theory and techniques; Packaging;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335110
