Title :
Substrate integrated power combiners
Author :
Boccia, L. ; Emanuele, A. ; Arnieri, E. ; Shamsafar, A. ; Amendola, G.
Author_Institution :
DEIS - Microwave Lab., Univ. of Calabria, Rende, Italy
Abstract :
In this work, preliminary results of a study on printed power combiners configurations for power-amplifier applications are presented. The proposed configuration is based on Substrate Integrated Waveguide (SIW) and multilayer PCB technologies. In particular, a printed horn combiner/divider was considered as a basic building block of a power combining amplifier. Simulated results of the passive combiners will be presented and discussed along with measured results.
Keywords :
power amplifiers; power combiners; power dividers; printed circuits; substrate integrated waveguides; SIW; multilayer PCB technologies; passive combiners; power combining amplifier; power-amplifier applications; printed horn combiner-divider; printed power combiner configurations; substrate integrated power combiners; substrate integrated waveguide; Bandwidth; Microstrip; Microwave FETs; Microwave amplifiers; Power combiners; Substrates; Substrate Integrated Waveguide (SIW); amplifier; power-combiner;
Conference_Titel :
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location :
Prague
Print_ISBN :
978-1-4577-0918-0
Electronic_ISBN :
978-1-4577-0919-7
DOI :
10.1109/EuCAP.2012.6206405
