Title :
Demonstration of fiber-based board-level optical clock distributions
Author :
Li, Y. ; Popelek, J. ; Rhee, J.-K. ; Wang, L.J. ; Wang, Ting ; Shum, Kai
Author_Institution :
NEC Res. Inst., Princeton, NJ, USA
Abstract :
Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13×19 cm2 are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed
Keywords :
optical fibre communication; parallel architectures; PCB; attenuations; coupling loss; dispersions; end-tapered; fiber bending loss; fiber bundles; optical clock distributions; thin-cladding fiber bundles; uniformity; Bandwidth; Circuit testing; Clocks; Optical attenuators; Optical fiber losses; Optical fiber testing; Optical fibers; Optical polymers; Printed circuits; Silicon compounds;
Conference_Titel :
Massively Parallel Processing, 1998. Proceedings. Fifth International Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-8186-8572-7
DOI :
10.1109/MPPOI.1998.682147
