DocumentCode
2191185
Title
A generalized method for evaluating the metallization thickness effects on microstrip structures
Author
Tzyy-Sheng Horng
Author_Institution
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fYear
1994
fDate
23-27 May 1994
Firstpage
1009
Abstract
This paper presents a generalized method for analyzing microstrip structures with finite metallization thickness. A spectral-domain approach that adopts proper current expansion functions is employed to find the three-dimensional current distribution in a finitely thick microstrip. Comparison of computed dispersion curves with available published data for microstrip lines of finite thickness illustrates the accuracy of this method. The influence of metallization thickness on discontinuities like patches and open-ends is also demonstrated.<>
Keywords
current distribution; metallisation; microstrip lines; spectral-domain analysis; waveguide theory; current expansion functions; discontinuities; dispersion curves; metallization thickness effects; microstrip structures; open-ends; patches; spectral-domain approach; three-dimensional current distribution; Current distribution; Metallization; Microstrip;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location
San Diego, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1778-5
Type
conf
DOI
10.1109/MWSYM.1994.335185
Filename
335185
Link To Document