DocumentCode :
2192228
Title :
The ACE family of MIL-STD-1553 terminals gets smaller
Author :
Friedman, Steven
Author_Institution :
ILC Data Device Corp., Bohemia, NY, USA
Volume :
1
fYear :
1997
fDate :
26-30 Oct 1997
Firstpage :
3.3
Abstract :
DDC´s Advanced Communications Engine (ACE) family of integrated MIL-STD-1553 terminals, featuring an advanced dual-redundant Remote Terminal (RT), Bus Controller (BC), and Bus Monitor (MT) functions, has been improved. This paper reviews the available features and technology used to achieve the cost enhancements and size reduction required to meet late 1990´s requirements. The mini-ACE is the functional equivalent to DDC´s well-established ACE product family, but in a package that is half the size. At one square inch, the mini-ACE is the smallest production RT/BC/MT terminal available. ILC DATA DEVICE CORPORATION (DDC) was able to accomplish this size reduction by utilizing state-of-the-art monolithic fabrication technology with a custom-designed ceramic co-fired package. The resultant multi-chip module (MCM) design supports both plug-in and surface mount applications. This paper discusses the processes and the technology used to develop the mini-ACE MCM. It also provides an overview of the packaging technology trade-offs considered before designing the custom co-fired package. A discussion about the custom, monolithic 5-volt transceivers and special programming pads, that help to support the smallest, functional ACE, is included. A review of the features and specifications offered to support Bus Interface and the host processor interface is also presented
Keywords :
CMOS integrated circuits; aircraft communication; aircraft computers; integrated circuit packaging; military avionics; monolithic integrated circuits; multichip modules; transceivers; 1 in; 5 V; ACE; COTS; MIL-STD-1553 terminals; advanced communications engine; bus controller; bus monitor; cost; custom-designed ceramic co-fired package; dual-redundant remote terminal; integrated MIL-STD-1553 terminals; mini-ACE MCM; monolithic fabrication; multi-chip module; plug-in and surface mount application; price; programming pads; size reduction; surface mount application; transceivers; Ceramics; Communication system control; Costs; Engines; Fabrication; Functional programming; Packaging; Production; Remote monitoring; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-4150-3
Type :
conf
DOI :
10.1109/DASC.1997.635052
Filename :
635052
Link To Document :
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