DocumentCode
2192280
Title
Hybrid of Job Sequencing and DVFS for Peak Temperature Reduction with Nondeterministic Applications
Author
Liu, Shaobo ; Qiu, Meikang ; Gao, Wenzhong ; Tang, Xiao-Jun ; Guo, Bin
Author_Institution
Dept. of ECE, State Univ. of New York at Binghamton, Binghamton, NY, USA
fYear
2010
fDate
June 29 2010-July 1 2010
Firstpage
1780
Lastpage
1787
Abstract
In this paper we propose a hybrid approach, which improves system thermal behavior with nondeterministic applications based on job sequencing as well as dynamic voltage and frequency selection (DVFS). The hybrid approach consists of two steps: 1) job sequencing and 2) lowering processor´s speed by using dynamic voltage and frequency selection. The first step constructs a job sequence based on the average execution time of each job; and the constructed job sequence interleaves executions of hot jobs and cool jobs. While a hot job pushes up the temperature of a chip, a cool job cools the chip down. Accordingly the job sequencing step reduces the peak temperature of a chip. The second step further improves system-wide thermal behavior by dynamic voltage and frequency selection, which slows down the execution of hot jobs by utilizing job slacks. Hot jobs are the rooted cause for deteriorating the thermal behavior of a processor, so we only slow down the execution of hot jobs and job slacks are allocated among hot jobs. Hot jobs whose execution time deviates more above their average execution time get more slack; vice versa. Experimental results show that the proposed hybrid approach improves the system thermal behavior for various nondeterministic workloads by reducing peak temperature as well as decreasing thermal variations.
Keywords
power aware computing; processor scheduling; thermal management (packaging); average execution time; cool job; dynamic voltage and frequency selection; hot job; job sequencing; nondeterministic application; nondeterministic workload; peak temperature reduction; processor speed; system thermal behavior; thermal variation; Embedded system; Frequency modulation; Program processors; Random variables; System-on-a-chip; Temperature; Thermal management; Thermal management; embedded systems; nondeterministic; peak temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer and Information Technology (CIT), 2010 IEEE 10th International Conference on
Conference_Location
Bradford
Print_ISBN
978-1-4244-7547-6
Type
conf
DOI
10.1109/CIT.2010.309
Filename
5577979
Link To Document