• DocumentCode
    2192280
  • Title

    Hybrid of Job Sequencing and DVFS for Peak Temperature Reduction with Nondeterministic Applications

  • Author

    Liu, Shaobo ; Qiu, Meikang ; Gao, Wenzhong ; Tang, Xiao-Jun ; Guo, Bin

  • Author_Institution
    Dept. of ECE, State Univ. of New York at Binghamton, Binghamton, NY, USA
  • fYear
    2010
  • fDate
    June 29 2010-July 1 2010
  • Firstpage
    1780
  • Lastpage
    1787
  • Abstract
    In this paper we propose a hybrid approach, which improves system thermal behavior with nondeterministic applications based on job sequencing as well as dynamic voltage and frequency selection (DVFS). The hybrid approach consists of two steps: 1) job sequencing and 2) lowering processor´s speed by using dynamic voltage and frequency selection. The first step constructs a job sequence based on the average execution time of each job; and the constructed job sequence interleaves executions of hot jobs and cool jobs. While a hot job pushes up the temperature of a chip, a cool job cools the chip down. Accordingly the job sequencing step reduces the peak temperature of a chip. The second step further improves system-wide thermal behavior by dynamic voltage and frequency selection, which slows down the execution of hot jobs by utilizing job slacks. Hot jobs are the rooted cause for deteriorating the thermal behavior of a processor, so we only slow down the execution of hot jobs and job slacks are allocated among hot jobs. Hot jobs whose execution time deviates more above their average execution time get more slack; vice versa. Experimental results show that the proposed hybrid approach improves the system thermal behavior for various nondeterministic workloads by reducing peak temperature as well as decreasing thermal variations.
  • Keywords
    power aware computing; processor scheduling; thermal management (packaging); average execution time; cool job; dynamic voltage and frequency selection; hot job; job sequencing; nondeterministic application; nondeterministic workload; peak temperature reduction; processor speed; system thermal behavior; thermal variation; Embedded system; Frequency modulation; Program processors; Random variables; System-on-a-chip; Temperature; Thermal management; Thermal management; embedded systems; nondeterministic; peak temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer and Information Technology (CIT), 2010 IEEE 10th International Conference on
  • Conference_Location
    Bradford
  • Print_ISBN
    978-1-4244-7547-6
  • Type

    conf

  • DOI
    10.1109/CIT.2010.309
  • Filename
    5577979