DocumentCode
2192616
Title
Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films
Author
Lee, Haebum ; Lopatin, Sergey D. ; Wong, S. Simon
Author_Institution
Center for Integrated Syst., Stanford Univ., CA, USA
fYear
2000
fDate
2000
Firstpage
114
Lastpage
116
Abstract
Electroplated Cu films with different plating conditions and different thickness are characterized during self- and thermal annealing. Faster recrystallization and stress development at room temperature are observed as the plating current density and film thickness are increased. Strong correlation between stress and texture behavior is found for all Cu films and is explained by the minimization of surface/interface energy and strain energy in anisotropic metal films
Keywords
annealing; copper; electroplated coatings; internal stresses; metallic thin films; recrystallisation texture; surface energy; Cu; anisotropic metal film; electroplating; interface energy; recrystallization; self-annealing; strain energy; stress; surface energy; texture; thermal annealing; Anisotropic magnetoresistance; Annealing; Capacitive sensors; Copper; Current density; Electric resistance; Grain size; Optical films; Surface texture; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location
Burlingame, CA
Print_ISBN
0-7803-6327-2
Type
conf
DOI
10.1109/IITC.2000.854298
Filename
854298
Link To Document