DocumentCode
2192631
Title
High-temperature performance of SOI and bulk-silicon RESURF LDMOS transistors
Author
Arnold, E. ; Letavic, T. ; Merchant, S. ; Bhimnathwala, H.
Author_Institution
Philips Electron. North America Corp., Philips Lab., Briarcliff Manor, NY, USA
fYear
1996
fDate
20-23 May 1996
Firstpage
93
Lastpage
96
Abstract
High-temperature off-state and on-state characteristics of bulk-Si and thin-SOI RESURF LDMOS transistors were studied experimentally and theoretically. The off-state leakage current in the SOI devices was only 1.5 nA/μm at 300°C. The increase of on-resistance with temperature in the SOI devices is smaller than in the bulk-Si devices because of the heavier doping dictated by the RESURF principle. The reverse recovery time of the SOI device shows only slight temperature dependence. The results of this study indicate that LDMOS transistors fabricated in thin SOI layers are well suited for high-temperature power IC applications
Keywords
high-temperature effects; power MOSFET; silicon; silicon-on-insulator; 300 C; RESURF LDMOS transistor; SOI device; Si; bulk-Si device; doping; high-temperature performance; leakage current; off-state characteristics; on-resistance; on-state characteristics; power IC; reverse recovery time; Doping; Laboratories; Leakage current; North America; Power integrated circuits; Roentgenium; Temperature dependence; Transistors; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 1996. ISPSD '96 Proceedings., 8th International Symposium on
Conference_Location
Maui, HI
ISSN
1063-6854
Print_ISBN
0-7803-3106-0
Type
conf
DOI
10.1109/ISPSD.1996.509456
Filename
509456
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