• DocumentCode
    2192631
  • Title

    High-temperature performance of SOI and bulk-silicon RESURF LDMOS transistors

  • Author

    Arnold, E. ; Letavic, T. ; Merchant, S. ; Bhimnathwala, H.

  • Author_Institution
    Philips Electron. North America Corp., Philips Lab., Briarcliff Manor, NY, USA
  • fYear
    1996
  • fDate
    20-23 May 1996
  • Firstpage
    93
  • Lastpage
    96
  • Abstract
    High-temperature off-state and on-state characteristics of bulk-Si and thin-SOI RESURF LDMOS transistors were studied experimentally and theoretically. The off-state leakage current in the SOI devices was only 1.5 nA/μm at 300°C. The increase of on-resistance with temperature in the SOI devices is smaller than in the bulk-Si devices because of the heavier doping dictated by the RESURF principle. The reverse recovery time of the SOI device shows only slight temperature dependence. The results of this study indicate that LDMOS transistors fabricated in thin SOI layers are well suited for high-temperature power IC applications
  • Keywords
    high-temperature effects; power MOSFET; silicon; silicon-on-insulator; 300 C; RESURF LDMOS transistor; SOI device; Si; bulk-Si device; doping; high-temperature performance; leakage current; off-state characteristics; on-resistance; on-state characteristics; power IC; reverse recovery time; Doping; Laboratories; Leakage current; North America; Power integrated circuits; Roentgenium; Temperature dependence; Transistors; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 1996. ISPSD '96 Proceedings., 8th International Symposium on
  • Conference_Location
    Maui, HI
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-3106-0
  • Type

    conf

  • DOI
    10.1109/ISPSD.1996.509456
  • Filename
    509456