• DocumentCode
    2192665
  • Title

    A three-dimensional stochastic wire-length distribution for variable separation of strata

  • Author

    Joyner, James W. ; Zarkesh-Ha, Payman ; Davis, Jeffrey A. ; Meindl, James D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    126
  • Lastpage
    128
  • Abstract
    A complete wire-length distribution for future three-dimensional, homogeneous gigascale integrated (GSI) architectures with variable vertical separation of strata is derived. Because stratal pitch was not found to impact the wire-length distribution significantly, bonded three-dimensional implementations which are technologically feasible can be used to obtain large increases in global clock frequencies. The longest interconnect can be reduced by 30% through the introduction of a single additional stratum. A 93% reduction in the length of the longest interconnect can be obtained through the optimal use of a three-dimensional architecture for a 100 nm ASIC, potentially leading to a 15.8 times increase in global clock frequency
  • Keywords
    application specific integrated circuits; integrated circuit interconnections; integrated circuit modelling; stochastic processes; ASIC; gigascale integration; global clock distribution; interconnect; stochastic wire length distribution; three-dimensional architecture; variable vertical strata separation; Application specific integrated circuits; Bonding; Clocks; Contracts; Frequency; Joining processes; Productivity; Stochastic processes; Transistors; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    0-7803-6327-2
  • Type

    conf

  • DOI
    10.1109/IITC.2000.854301
  • Filename
    854301