DocumentCode
2192665
Title
A three-dimensional stochastic wire-length distribution for variable separation of strata
Author
Joyner, James W. ; Zarkesh-Ha, Payman ; Davis, Jeffrey A. ; Meindl, James D.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2000
fDate
2000
Firstpage
126
Lastpage
128
Abstract
A complete wire-length distribution for future three-dimensional, homogeneous gigascale integrated (GSI) architectures with variable vertical separation of strata is derived. Because stratal pitch was not found to impact the wire-length distribution significantly, bonded three-dimensional implementations which are technologically feasible can be used to obtain large increases in global clock frequencies. The longest interconnect can be reduced by 30% through the introduction of a single additional stratum. A 93% reduction in the length of the longest interconnect can be obtained through the optimal use of a three-dimensional architecture for a 100 nm ASIC, potentially leading to a 15.8 times increase in global clock frequency
Keywords
application specific integrated circuits; integrated circuit interconnections; integrated circuit modelling; stochastic processes; ASIC; gigascale integration; global clock distribution; interconnect; stochastic wire length distribution; three-dimensional architecture; variable vertical strata separation; Application specific integrated circuits; Bonding; Clocks; Contracts; Frequency; Joining processes; Productivity; Stochastic processes; Transistors; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location
Burlingame, CA
Print_ISBN
0-7803-6327-2
Type
conf
DOI
10.1109/IITC.2000.854301
Filename
854301
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