• DocumentCode
    2193015
  • Title

    When should on-chip inductance modeling become necessary for VLSI timing analysis?

  • Author

    Chang, Li-Fu ; Chang, Keh-Jeng ; Mathews, Robert

  • Author_Institution
    Frequency Technol. Inc., Santa Clara, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    170
  • Lastpage
    172
  • Abstract
    Copper-based 0.13 μm technologies targeting System-on-a-Chip (SoC) are becoming available for VLSI designs, while aluminum-based 0.18 μm and 0.25 μm technologies are being used by main-stream, high-end VLSI design groups. Besides material change and technology scaling, other factors that make on-chip inductance modeling become more important are: integration level, harmonic frequency, design style, et al. In essence, many process and layout parameters of today´s VLSI designs can have potentially first-order effects on how much inductance modeling affects the timing of a critical net. In this paper, our research result indicate the most critical parameters are material property, process feature size, interconnect length, and driver size. We use typical but critical signal nets in VLSI chips, model them by 3-D RLC extractor, and simulate them by SPICE. This methodology can help identify a proper subset of nets that require detailed RLC-based timing analysis. In this way, more efficient timing analysis without considering inductance modeling (e.g. for SoC) can be performed for other nets
  • Keywords
    SPICE; VLSI; inductance; integrated circuit design; integrated circuit modelling; timing; 3D RLC extractor; SPICE simulation; VLSI design; critical net; on-chip inductance model; system-on-a-chip; timing analysis; Capacitance; Circuit simulation; Delay; Frequency; Inductance; Integrated circuit interconnections; RLC circuits; System-on-a-chip; Timing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    0-7803-6327-2
  • Type

    conf

  • DOI
    10.1109/IITC.2000.854315
  • Filename
    854315