• DocumentCode
    2193216
  • Title

    Curbing energy cravings in networks: A cross-sectional view across the micro-macro boundary

  • Author

    Ganguly, Amlan ; Kundu, Partha ; Bose, Pradip

  • Author_Institution
    Dept. of Comput. Eng., Rochester Inst. of Technol., Rochester, NY, USA
  • fYear
    2011
  • fDate
    1-4 May 2011
  • Firstpage
    241
  • Lastpage
    246
  • Abstract
    The soaring power dissipation of computing infrastructures has effectively become a key performance bottleneck. At the same time, thermal issues arising from power hungry devices result in compromising reliability of such systems. At present, the processor cores within a chip multiprocessor (CMP) are interconnected using on-chip networks. At the same time, the emerging era of cloud computing and the associated large-scale distributed computing model are stretching the limits of computer networking. Hence, as an essential and pervasive fabric that binds all computing machinery, there is an underlying network that appears with varying scale and characteristics. In this paper, we take a look at methodologies for better management of the power budget across the cross-section of computing systems traversing the boundary between micro-level on-chip networks to macro-level cloud computing. We discuss methodologies for power and thermal management both at micro and macro scales and explore the role of one in reducing the power budget of the other.
  • Keywords
    cloud computing; low-power electronics; microprocessor chips; network-on-chip; power aware computing; thermal management (packaging); chip multiprocessor; computer networking; computing infrastructure; cross-sectional view; curbing energy craving; distributed computing model; macro-level cloud computing; micro-level on-chip network; micro-macro boundary; pervasive fabric; power budget management; processor cores; soaring power dissipation; system reliability; thermal issue; thermal management; Network topology; Photonics; Power dissipation; Servers; System-on-a-chip; Three dimensional displays; Wireless communication; Cloud Computing; Data Center; Interconnect; Network-on-Chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networks on Chip (NoCS), 2011 Fifth IEEE/ACM International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • Electronic_ISBN
    978-1-4503-0720-8
  • Type

    conf

  • Filename
    5948570