Title :
Half-conductive coupling interconnection technology for digital transmission between CMOS chips
Author :
Pan, W. ; Devisch, F. ; Tandt, C. De ; Vounckx, R. ; Kuijk, M.
Author_Institution :
Electron. Div., IMEC, Leuven, Belgium
Abstract :
This paper describes for the first time how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chipped standard CMOS chips. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Due to shielding effects, the technology promises ultra-high-density interconnections
Keywords :
CMOS digital integrated circuits; flip-chip devices; integrated circuit interconnections; CMOS chip; digital transmission; flip-chip; half-conductive coupling; ultra-high-density interconnection technology; CMOS process; CMOS technology; Conducting materials; Conductivity; Couplings; Flip chip; Inverters; Parasitic capacitance; SPICE; Topology;
Conference_Titel :
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location :
Burlingame, CA
Print_ISBN :
0-7803-6327-2
DOI :
10.1109/IITC.2000.854333
