Title :
Exploring partitioning methods for 3D Networks-on-Chip utilizing adaptive routing model
Author :
Ebrahimi, Masoumeh ; Daneshtalab, Masoud ; Liljeberg, Pasi ; Plosila, Juha ; Tenhunen, Hannu
Author_Institution :
Dept. of Inf. Technol., Univ. of Turku, Turku, Finland
Abstract :
Three-Dimensional (3D) integration is a solution to the interconnect bottleneck in Two-Dimensional (2D) Multi-Processor System on Chip (MPSoC). 3D IC design improves performance and decreases power consumption by replacing long horizontal interconnects with shorter vertical ones. As the multicast communication is utilized commonly in various parallel applications, the performance can be significantly improved by supporting of multicast operations at the hardware level. In this paper, we propose a set of partitioning approaches each with a different level of efficiency. In addition, we present an advantageous method named Recursive Partitioning (RP) in which the network is recursively partitioned until all partitions contain comparable number of nodes. By this approach, the multicast traffic is distributed among several subsets and the network latency is considerably decreased. We also present Minimal Adaptive Routing (MAR) algorithm for the unicast and multicast traffic in 3D-mesh Networks-on-Chip (NoCs). The idea behind the MAR algorithm is utilizing the Hamiltonian path to provide a set of alternative paths.
Keywords :
integrated circuit design; network routing; network-on-chip; recursive estimation; system-on-chip; three-dimensional integrated circuits; 3D IC design; 3D-mesh network-on-chip; Hamiltonian path; MAR algorithm; adaptive routing model; minimal adaptive routing algorithm; multicast communication; multicast traffic; recursive partitioning; three-dimensional integration; two-dimensional multiprocessor system on chip; Algorithm design and analysis; Partitioning algorithms; Protocols; Routing; System recovery; Three dimensional displays; Unicast; Algorithms; Design; Performance;
Conference_Titel :
Networks on Chip (NoCS), 2011 Fifth IEEE/ACM International Symposium on
Conference_Location :
Pittsburgh, PA
Electronic_ISBN :
978-1-4503-0720-8