Title :
Investigations on novel coaxial transmission line structures on MCM-L
Author :
Thiel, Andreas ; Habiger, Claus ; Tröster, Gerhard
Author_Institution :
Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
This paper presents recent investigations on a novel transmission line structure with improved RF-performance and increased shielding capability based on MCM-L interconnect technology. Three key issues are addressed: Maximization of usable interconnect bandwidth, reproducibility of the characteristic electrical properties in large-volume production, and minimization of inter-signal and electromagnetic interference. Thanks to recent improvements of MCM-L technology this new structure is processable in a cost-effective roll-to-roll production cycle. The electrical properties of the new structure are deduced from the well-known coaxial and triplate transmission line models. Furthermore, FEM-simulation results provide an estimation of the limitations of the proposed structure, which are caused by conductor and dielectric losses. The design of a test-vehicle intended for verification of the simulation results is presented. And finally, measurement results obtained from TDR/TDT and VNA measurement setups are reported and compared to the theoretical estimations
Keywords :
coaxial cables; electromagnetic interference; electromagnetic shielding; finite element analysis; multichip modules; FEM simulation; MCM-L; RF performance; TDR/TDT measurement; VNA measurement; coaxial transmission line; conductor loss; design; dielectric loss; electrical properties; electromagnetic interference; inter-signal interference; interconnect bandwidth; large-volume production; reproducibility; roll-to-roll production cycle; shielding; triplate model; Bandwidth; Coaxial components; Dielectric losses; Dielectric measurements; Electromagnetic interference; Production; Reproducibility of results; Transmission line measurements; Transmission line theory; Transmission lines;
Conference_Titel :
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7789-9
DOI :
10.1109/MCMC.1997.569343