Title :
Antenna-in-package solutions for 60 GHz communication links
Author :
Enayati, Amin ; Vandenbosch, Guy A E ; De Raedt, Walter
Abstract :
Two multilayer technologies have been used two introduce antenna-in-package solutions for millimeter wave applications such as multi-gigabit-per-second communication transceivers. The first technology is a commercially available PCB technology incorporating microwave-compatible laminates yielding acceptable losses at high frequencies. The second technology is a thin-film Silicon-based one using some advanced micro-machining capabilities to implement the antenna-in-package solution. Both of them are compared for their simulation and measurement results followed by discussions on how efficient they are to be used for the 60 GHz application.
Keywords :
millimetre wave antennas; radio links; radio transceivers; advanced micromachining capabilities; antenna-in-package solutions; commercially available PCB technology; communication links; frequency 60 GHz; microwave-compatible laminates; millimeter wave applications; multi-gigabit-per-second communication transceivers; multilayer technologies; thin-film silicon; Antenna arrays; Antenna measurements; Antenna radiation patterns; Loss measurement; Millimeter wave technology; Probes; PCB technology; antenna-in-package siolutions; millimeter-waves; thin-film tehnology;
Conference_Titel :
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location :
Prague
Print_ISBN :
978-1-4577-0918-0
Electronic_ISBN :
978-1-4577-0919-7
DOI :
10.1109/EuCAP.2012.6206584
