• DocumentCode
    2194573
  • Title

    Precision embedded thin film resistors for multichip modules (MCM-D)

  • Author

    Lin, Chang-Ming ; Logan, Elizabeth A. ; Tuckerman, David

  • Author_Institution
    nCHIP Inc., San Jose, CA, USA
  • fYear
    1997
  • fDate
    4-5 Feb 1997
  • Firstpage
    44
  • Lastpage
    49
  • Abstract
    A precision integral resistor process has been successfully developed using a 10 Ω/sq. tantalum nitride thin film. Although the integral resistors are overcoated by 6 μm of PECVD silicon dioxide, a precision laser trimming process was developed which is capable of trimming the embedded resistors to 50 Ω with an accuracy of better than ±0.5 Ω (1%) and with no damage to the surrounding structure. The stability of the trimmed resistors has been demonstrated and the average post-trim TCR value can be improved by up to 33%, depending upon the characteristics of the laser system. Trimmed integral resistors have also been examined by transmission electron microscope (TEM). Secondary grain growth within the trimmed resistor and spherical inclusions in the oxide near to trimmed resistor regions were observed by this analysis. As part of a reliability evaluation, the trimmed resistors were subjected to a severe manual thermal shock test over a ΔT of ~500°C without catastrophic failure
  • Keywords
    grain growth; inclusions; laser beam machining; multichip modules; thin film resistors; transmission electron microscopy; MCM-D; PECVD silicon dioxide; SiO2; TCR; TaN; integral resistor; laser trimming; multichip module; precision embedded thin film resistor; reliability; secondary grain growth; spherical inclusions; stability; tantalum nitride thin film; thermal shock test; transmission electron microscopy; Conductivity; Laser ablation; Laser stability; Multichip modules; Optical design; Resistors; Silicon compounds; Sputtering; Substrates; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-7789-9
  • Type

    conf

  • DOI
    10.1109/MCMC.1997.569344
  • Filename
    569344