Title :
A novel MMIC coupler-measured and simulated data
Author :
Mernyei, F. ; Aoki, I. ; Matsuura, H.
Author_Institution :
Dept. of Res. & Dev., Teratec Corp., Tokyo, Japan
Abstract :
This paper presents wafer measurements and parameter extraction on a Broadside-Offset-Coupled Coplanar-Microstrip (BOC-CPW-MS) coupler. This passive structure was fabricated by using multilayer MMIC technology which allows us to realize couplers with various coupling values, controlled by its geometry. The control of the coupling in the -3 to -30 dB range with a 100% bandwidth at 30 GHz center frequency was achieved.<>
Keywords :
MMIC; equivalent circuits; microstrip components; waveguide couplers; 30 GHz; CPW; MMIC coupler; broadside-offset-coupled type; coplanar-microstrip coupler; multilayer MMIC technology; parameter extraction; passive structure; wafer measurements; Bandwidth; Frequency; Geometry; MMICs; Nonhomogeneous media; Parameter extraction;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335330
