Applications of virtual modeling to the development of a 39 GHz MMIC transceiver on multilayer Multi Chip Assembly (MCA) substrate

Author

Mondal, J. ; Bogus, E. ; Ahmed, S. ; Dietz, G. ; Sahm, P. ; Nguyen, T. ; Yusim, M.

Author_Institution

Div. of Defensive Syst., Northrop Grumman Corp., Rolling Meadows, IL, USA

fYear

2000

fDate

10-13 June 2000

Firstpage

47

Lastpage

50

Abstract

Development and hardware performance of a 39 GHz millimeter wave (MM-wave) transceiver that uses highly integrated Monolithic Microwave Integrated Circuits (MMIC) and a multilayer MM-wave board are described. The design process involved virtual prototyping using behavioral models of the transmit-receive functions and the MM-wave interconnects on a multilayer Multi Chip Assembly (MCA) substrate, The paper describes optimum system partitioning, specification generation of various blocks that include highly integrated MMICs, MCA interconnects, and the integrated antenna. The MMICs and MCA were designed and fabricated after going through specification flow down and capability up cycles using virtual prototyping. The transceiver modules have been demonstrated for short distance communication links at data rates exceeding 1 Mbps. The data rate is limited by the application software used. To our knowledge this is the first time virtual prototyping has been applied to a complex MM-wave system that involves highly integrated MMIC and MCA.

Keywords

MIMIC; circuit CAD; integrated circuit design; integrated circuit interconnections; multichip modules; transceivers; 1 Mbit/s; 39 GHz; EHF; MIMIC transceiver; MM-wave interconnects; MM-wave transceiver; MMIC transceiver; behavioral models; data rate; integrated antenna; millimeter-wave transceiver; multi chip assembly substrate; multilayer MCA substrate; optimum system partitioning; short distance communication links; specification generation; transceiver modules; transmit-receive functions; virtual modeling; virtual prototyping; Hardware; Integrated circuit interconnections; MIMICs; MMICs; Microwave integrated circuits; Millimeter wave communication; Monolithic integrated circuits; Nonhomogeneous media; Transceivers; Virtual prototyping;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2000. Digest of Papers. 2000 IEEE

Conference_Location

Boston, MA, USA

ISSN

1529-2517

Print_ISBN

0-7803-6280-2

Type

conf

DOI

10.1109/RFIC.2000.854414

Filename

854414