Antenna-in-package using PCB and IPD technologies for 60 GHz applications

Author

Titz, Diane ; Ferrero, Fabien ; Luxey, Cyril ; Jacquemod, Gilles ; Laporte, Claire ; Ezzeddine, Hilal

Author_Institution

LEAT, Univ. Nice-Sophia Antipolis, Valbonne, France

fYear

2012

fDate

26-30 March 2012

Firstpage

2591

Lastpage

2594

Abstract

In this paper, we present several antennas for 60 GHz low-cost packaged modules. These antennas are fabricated using a PCB substrate and the IPD™ technology. In the first part, an antenna is etched on the Taclamplus substrate from Taconic and shows very promising performances. In the second part, a microstrip line on this substrate is directly coupled to an upper patch antenna fabricated in the IPD™ technology from ST Microelectronics. The purpose is to increase the matching bandwidth and still address a low-cost antenna-in-package solution.

Keywords

microstrip antennas; microstrip lines; packaging; printed circuits; IPD technologies; PCB substrate; PCB technologies; Taclamplus substrate; antenna-in-package; frequency 60 GHz; low-cost packaged modules; microstrip line; patch antenna; Antenna measurements; Frequency measurement; Gain; Gain measurement; Patch antennas; Substrates; 60 GHz antenna; IPD technology; PCB substrate; patch antenna;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EUCAP), 2012 6th European Conference on

Conference_Location

Prague

Print_ISBN

978-1-4577-0918-0

Electronic_ISBN

978-1-4577-0919-7

Type

conf

DOI

10.1109/EuCAP.2012.6206618

Filename

6206618