DocumentCode
2195976
Title
Antennas on Silicon: Hybrid integration versus SoC solutions?
Author
Person, Ch ; Calvez, Ch ; Guzman, J.P. ; Pinto, Y.C. ; Ney, M. ; Belot, D. ; Gloria, D. ; Pilard, R. ; Pache, D. ; Demirel, N. ; Kerhervé, E.
Author_Institution
Lab.-STICC, Telecom Bretagne, Brest, France
fYear
2012
fDate
26-30 March 2012
Firstpage
2599
Lastpage
2603
Abstract
Silicon technologies are now competitive with III-V components for applications in the millimeter wave frequencies range, as already demonstrated through fully integrated on-chip systems [1]-[6]. We discuss in this paper of the different thinkable alternative solutions to fully implement efficient antennas within Silicon environment, exploiting either SoC (System on Chip) or SiP (System in Package) approaches depending on the expected performances.
Keywords
BiCMOS integrated circuits; elemental semiconductors; millimetre wave antennas; silicon; system-in-package; system-on-chip; III-V components; Si; SiP approach; SoC approach; SoC solutions; antennas on silicon; hybrid integration; integrated on-chip systems; millimeter wave frequencies range; silicon environment; silicon technologies; system-in-package; system-on-chip; Antenna measurements; BiCMOS integrated circuits; Dipole antennas; Gain; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location
Prague
Print_ISBN
978-1-4577-0918-0
Electronic_ISBN
978-1-4577-0919-7
Type
conf
DOI
10.1109/EuCAP.2012.6206644
Filename
6206644
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