Title :
Antennas on Silicon: Hybrid integration versus SoC solutions?
Author :
Person, Ch ; Calvez, Ch ; Guzman, J.P. ; Pinto, Y.C. ; Ney, M. ; Belot, D. ; Gloria, D. ; Pilard, R. ; Pache, D. ; Demirel, N. ; Kerhervé, E.
Author_Institution :
Lab.-STICC, Telecom Bretagne, Brest, France
Abstract :
Silicon technologies are now competitive with III-V components for applications in the millimeter wave frequencies range, as already demonstrated through fully integrated on-chip systems [1]-[6]. We discuss in this paper of the different thinkable alternative solutions to fully implement efficient antennas within Silicon environment, exploiting either SoC (System on Chip) or SiP (System in Package) approaches depending on the expected performances.
Keywords :
BiCMOS integrated circuits; elemental semiconductors; millimetre wave antennas; silicon; system-in-package; system-on-chip; III-V components; Si; SiP approach; SoC approach; SoC solutions; antennas on silicon; hybrid integration; integrated on-chip systems; millimeter wave frequencies range; silicon environment; silicon technologies; system-in-package; system-on-chip; Antenna measurements; BiCMOS integrated circuits; Dipole antennas; Gain; Silicon;
Conference_Titel :
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location :
Prague
Print_ISBN :
978-1-4577-0918-0
Electronic_ISBN :
978-1-4577-0919-7
DOI :
10.1109/EuCAP.2012.6206644
