DocumentCode
2195994
Title
Lattice thermal conductivity of self-assembled PbTe-Sb2 Te3 composites with nanometer lamellae
Author
Ikeda, Teruyuki ; Toberer, Eric S. ; Ravi, Vilupanur A. ; Haile, Sossina M. ; Snyder, G.Jeffrey
Author_Institution
California Inst. of Technol., Pasadena, CA
fYear
2007
fDate
3-7 June 2007
Firstpage
1
Lastpage
4
Abstract
In the system of PbTe and Sb2Te3, a metastable compound Pb2Sb6Te11 appears by solidification processing. It has been reported that heat treatments decomposes this compound into two immiscible thermoelectric materials forming nanosized lamellar structure. The fraction transformed and the inter-lamellar spacing was systematically investigated. In this work, the thermal conductivities and the electrical resistivities have been measured as functions of annealing time through the transformation and the coarsening processes to clarify the effect of the fraction transformed and the inter-lamellar spacing. The thermal conductivity of Pb2Sb6Te11 is lower than that after the decomposition. The lattice part of the thermal conductivity of PbTe/Sb2Te3 lamellar samples decreases with decreasing inter-lamellar spacing. This is considered to be due to the coarsening of the microstructure.
Keywords
annealing; antimony compounds; electrical resistivity; lead compounds; nanocomposites; pyrolysis; self-assembly; solidification; thermal conductivity; thermoelectricity; Pb2Sb6Te11; annealing; coarsening process; decomposition; electrical resistivities; heat treatments; immiscible thermoelectric materials; lamellar structure; lattice thermal conductivity; metastable compound; microstructure; nanometer lamellae; self-assembled composites; solidification; transformation process; Conducting materials; Heat treatment; Lattices; Metastasis; Nanostructured materials; Nanostructures; Tellurium; Thermal conductivity; Thermal resistance; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location
Jeju Island
ISSN
1094-2734
Print_ISBN
978-1-4244-2262-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2007.4569408
Filename
4569408
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