• DocumentCode
    2196523
  • Title

    Functionally Graded Bi2Te3 based material for above ambient temperature application

  • Author

    Ben-Yehuda, O. ; Gelbstein, Y. ; Dashevsky, Z. ; George, Y. ; Dariel, M.P.

  • Author_Institution
    Dept. of Phys., Ben-Gurion Univ., Beer-Sheva
  • fYear
    2007
  • fDate
    3-7 June 2007
  • Firstpage
    82
  • Lastpage
    85
  • Abstract
    This study is concerned with the preparation of Bi0.4Sb1.6Te3 functionally graded (FG) samples by a powder metallurgical approach for above ambient temperature applications. The FG sample is based on two components with different carrier concentration. The first is designed for a maximal figure of merit at room temperature, the second, doped with Pb, is meant for operation at higher temperatures. The transport properties of the two components of the FG sample, namely the Seebeck coefficient and electrical resistivity, have been determined from room temperature up to 550 K. The preparation of FG samples, their chemical stability and their transport properties over this temperatures range were examined and will be discussed.
  • Keywords
    Seebeck effect; antimony compounds; bismuth compounds; carrier density; crystal growth from melt; electrical resistivity; functionally graded materials; lead; powder metallurgy; semiconductor growth; semiconductor materials; Bi0.4Sb1.6Te3; Bi0.4Sb1.6Te3:Pb; Seebeck coefficient; carrier concentration; chemical stability; electrical resistivity; figure of merit; functionally graded material; p-type semiconductor; powder metallurgy; temperature 293 K to 550 K; transport property; Bismuth; Chemicals; Electric resistance; Electric variables measurement; Powders; Pressing; Stability; Temperature distribution; Thermoelectricity; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2007. ICT 2007. 26th International Conference on
  • Conference_Location
    Jeju Island
  • ISSN
    1094-2734
  • Print_ISBN
    978-1-4244-2262-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2007.4569429
  • Filename
    4569429