• DocumentCode
    2196865
  • Title

    Dielectric recovery of copper chromium vacuum interrupter contacts after short circuit interruption

  • Author

    Huber, E. ; Frohlich, K. ; Grill, R.

  • Author_Institution
    Univ. of Technol., Vienna, Austria
  • Volume
    1
  • fYear
    1996
  • fDate
    21-26 Jul 1996
  • Firstpage
    351
  • Abstract
    The recovery of a vacuum interrupter gap after short circuit interruption was measured by application of an overshooting transient recovery voltage (TRV) several tens of microseconds after current zero. Copper chromium contact materials were employed varying in composition (25% and 50% chromium content), gas content and production method. The gap failure was either pure dielectric or it was dominated by a significant post arc current. Correlation between these post arc current facilitated failures, the ultimately dielectric recovery and the erosion rate of the material was found. Strong indication is given that all these effects are dominated by the metal vapor pressure rise given by the constricted rotating arc. A significant influence of the material properties can be drawn from these experiments, allowing a good estimation on the capability for short circuit current interruption, thus providing a useful tool for material development
  • Keywords
    chromium alloys; circuit-breaking arcs; copper alloys; electrical contacts; short-circuit currents; vacuum arcs; vacuum interrupters; CuCr; CuCr contacts; constricted rotating arc; copper chromium vacuum interrupter contacts; dielectric recovery; erosion rate; gap failure; gas content; metal vapor pressure rise; overshooting transient recovery voltage; post arc current; short circuit interruption; vacuum interrupter gap; Chromium; Circuits; Composite materials; Copper; Current measurement; Dielectric materials; Dielectric measurements; Interrupters; Transient analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    0-7803-2906-6
  • Type

    conf

  • DOI
    10.1109/DEIV.1996.545380
  • Filename
    545380