• DocumentCode
    2197065
  • Title

    Clues for Modeling and Diagnosing Open Faults with Considering Adjacent Lines

  • Author

    Takahashi, Hiroki ; Higami, Yoshinobu ; Kadoyama, S. ; Aikyo, Takashi ; Takamatsu, Yusuke ; Yamazaki, Kinya ; Tsutsumi, Takuya ; Yotsuyanagi, Hiroyuki ; Hashizume, Masaki

  • Author_Institution
    Ehime Univ., Matsuyama
  • fYear
    2007
  • fDate
    8-11 Oct. 2007
  • Firstpage
    39
  • Lastpage
    44
  • Abstract
    Under the modern manufacturing technologies, the open defect is one of the significant issues to maintain the reliability of DSM circuits. However, the modeling and techniques for test and diagnosis for open faults have not been established yet. In this paper, we give an important clue for modeling an open fault with considering the affects of adjacent lines. Firstly, we use computer simulations to analyze the defective behaviors of a line with the open defect. From the simulation results, we propose a new open fault model that is excited depending on the logic values at the adjacent lines assigned by a test. Next, we propose a diagnosis method that uses the pass/fail information to deduce the candidate open fault. Finally, experimental results show that the proposed method is able to diagnose the open faults with good resolution. It takes about 6 minutes to diagnose the open fault on the large circuit (2M gates).
  • Keywords
    circuit simulation; fault diagnosis; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; adjacent lines; computer simulation; integrated circuit modeling; integrated circuit reliability; integrated circuit testing; open defects; open faults; Circuit faults; Circuit testing; Computational modeling; Computer simulation; Copper; Crosstalk; Fault diagnosis; Integrated circuit interconnections; Logic testing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Test Symposium, 2007. ATS '07. 16th
  • Conference_Location
    Beijing
  • ISSN
    1081-7735
  • Print_ISBN
    978-0-7695-2890-8
  • Type

    conf

  • DOI
    10.1109/ATS.2007.34
  • Filename
    4387980