• DocumentCode
    2197081
  • Title

    Characterization and Analysis of Airborne Metal Exposures Among Electronic Scrap Valuation Workers- Shredding

  • Author

    Kent, M.S. ; Corbett, M.L. ; Glavin, M.

  • Author_Institution
    Brush Wellman Inc., Elmore, OH
  • fYear
    2006
  • fDate
    8-11 May 2006
  • Firstpage
    224
  • Lastpage
    227
  • Abstract
    Recycling is the most appropriate final step in the electronics life cycle. Certain materials contained in electronics can be environmental and occupational health concerns. More information is needed to properly assess occupational health risks presented by recycling operations. A quantitative airborne metal exposure survey was conducted on workers shredding printed circuit boards. Aluminum, arsenic, beryllium, calcium, cadmium, chromium, copper, iron, lead, magnesium, manganese, nickel, selenium, sodium and zinc were all well below permissible exposure levels (PEL). Airborne silver exposures were above the PEL 11.0 percent of the time. Attempts to correlate air sample results with concurrently collected bulk sample metal concentrations were not successful. The Untha shear shredder equipped with ventilation, as is typical in the industry, represents a minimal inhalation hazard regarding silver and no inhalation hazard to the operators for all other metals studied
  • Keywords
    electronics industry; health hazards; printed circuits; recycling; scrap metal; Untha shear shredder; airborne metal exposure survey; airborne metal exposures; airborne silver exposures; bulk sample metal concentrations; electronic scrap valuation workers; electronics life cycle; inhalation hazard; occupational health risks; permissible exposure levels; printed circuit boards; recycling; shredding; Aluminum; Cadmium; Calcium; Conducting materials; Cost accounting; Hazards; Occupational health; Printed circuits; Recycling; Silver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
  • Conference_Location
    Scottsdale, AZ
  • ISSN
    1095-2020
  • Print_ISBN
    1-4244-0351-0
  • Type

    conf

  • DOI
    10.1109/ISEE.2006.1650065
  • Filename
    1650065