DocumentCode
2197081
Title
Characterization and Analysis of Airborne Metal Exposures Among Electronic Scrap Valuation Workers- Shredding
Author
Kent, M.S. ; Corbett, M.L. ; Glavin, M.
Author_Institution
Brush Wellman Inc., Elmore, OH
fYear
2006
fDate
8-11 May 2006
Firstpage
224
Lastpage
227
Abstract
Recycling is the most appropriate final step in the electronics life cycle. Certain materials contained in electronics can be environmental and occupational health concerns. More information is needed to properly assess occupational health risks presented by recycling operations. A quantitative airborne metal exposure survey was conducted on workers shredding printed circuit boards. Aluminum, arsenic, beryllium, calcium, cadmium, chromium, copper, iron, lead, magnesium, manganese, nickel, selenium, sodium and zinc were all well below permissible exposure levels (PEL). Airborne silver exposures were above the PEL 11.0 percent of the time. Attempts to correlate air sample results with concurrently collected bulk sample metal concentrations were not successful. The Untha shear shredder equipped with ventilation, as is typical in the industry, represents a minimal inhalation hazard regarding silver and no inhalation hazard to the operators for all other metals studied
Keywords
electronics industry; health hazards; printed circuits; recycling; scrap metal; Untha shear shredder; airborne metal exposure survey; airborne metal exposures; airborne silver exposures; bulk sample metal concentrations; electronic scrap valuation workers; electronics life cycle; inhalation hazard; occupational health risks; permissible exposure levels; printed circuit boards; recycling; shredding; Aluminum; Cadmium; Calcium; Conducting materials; Cost accounting; Hazards; Occupational health; Printed circuits; Recycling; Silver;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location
Scottsdale, AZ
ISSN
1095-2020
Print_ISBN
1-4244-0351-0
Type
conf
DOI
10.1109/ISEE.2006.1650065
Filename
1650065
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