Title :
Characterization of RF/microwave packaging structures
Author :
Cyrusian, S. ; Fotheringham, G.
Author_Institution :
Res. Center for Microperipheric Technol., Tech. Univ. of Berlin, Germany
Abstract :
Various RF/microwave packaging structures are investigated by a numerical full wave analysis. In frequency ranges up to 80 GHz chip contacting methods are characterized. Coplanar waveguide-to-coax and -to-microstrip and coax-to-microstrip transitions are treated. Optimization and sensitivity curves are given. The simulation results can be used for introducing some standard RF/microwave packaging structures
Keywords :
circuit analysis computing; coaxial cables; coplanar waveguides; integrated circuit packaging; microstrip lines; microwave integrated circuits; numerical analysis; optimisation; sensitivity; 80 GHz; RF/microwave packaging structures; chip contacting methods; coax-to-microstrip transitions; coplanar waveguide-to-coax transitions; coplanar waveguide-to-microstrip transitions; frequency ranges; numerical full wave analysis; optimization curves; sensitivity curves; simulation results; Bonding; Coaxial components; Connectors; Coplanar waveguides; Magnetic materials; Packaging; Radio frequency; Substrates; Waveguide transitions; Wire;
Conference_Titel :
Microwave and Optoelectronics Conference, 1995. Proceedings., 1995 SBMO/IEEE MTT-S International
Conference_Location :
Rio de Janeiro
Print_ISBN :
0-7803-2674-1
DOI :
10.1109/SBMOMO.1995.509642
