Title :
A low cost MCM-D technology applied to microwave integrated circuits
Author :
Finardi, Célio A. ; Neto, Victor Patiri ; Fischer, R.A. ; Flacker, Alexander ; Barnett, M. ; De Almeida, Antcmio M. ; GozZi, Antonio C. ; Pagotto, Ana C.
Author_Institution :
Res. & Dev. Centre, Telecomunicacoes Brasileiras SA, Campinas, Brazil
Abstract :
The paper presents a new technological solution for fabricating microwave integrated circuits (MICs). This innovative approach is based on a deposited-multichip modules (MCM-D) technology developed at the R&D Centre of TELEBRAS. A description of the processing is presented and some results of MICs fabricated on alumina 96% are shown. The main features of this packaging technology are its low cost (<US$1.5/in 2), process simplification, reproducibility and microwave devices assembly compatibility. The paper demonstrates an easy solution for MICs fabrication that can be implemented with low investments
Keywords :
hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; microwave integrated circuits; multichip modules; Al2O3; MCM-D technology; MIC fabrication; TELEBRAS; alumina; deposited-multichip modules; low cost MCM-D technology; microwave devices assembly compatibility; microwave integrated circuits; packaging technology; reproducibility; Assembly; Costs; Fabrication; Integrated circuit packaging; Integrated circuit technology; Microwave devices; Microwave integrated circuits; Microwave technology; Paper technology; Reproducibility of results;
Conference_Titel :
Microwave and Optoelectronics Conference, 1995. Proceedings., 1995 SBMO/IEEE MTT-S International
Conference_Location :
Rio de Janeiro
Print_ISBN :
0-7803-2674-1
DOI :
10.1109/SBMOMO.1995.509644
