Title :
Intrinsic area array ICs: what, why, and how
Author :
Dehkordi, Peyman ; Tan, Chandra ; Bouldin, Donald
Author_Institution :
Dept. of Electr. Eng., Tennessee Univ., Knoxville, TN, USA
Abstract :
Area-array bonding technology (i.e. flip-chip, C4) was pioneered by IBM in the late 1960´s as an alternative to periphery bonding technology (i.e. wire-bond). In recent years, several commercial companies have started offering bumping and flip-chip services. Flip-chip technology is expected to grow at at compound annual growth rate of 38% through the year 2001. The purpose of this paper is to address the IC design issues and alternatives that are presently being used for area-array bonding technology and show the impact of these design issues at the system level
Keywords :
flip-chip devices; integrated circuit design; microassembling; multichip modules; C4 bonding; IC design; area-array bonding technology; flip-chip technology; intrinsic area array ICs; Assembly; Bonding; Costs; Flip chip; Integrated circuit packaging; Manufacturing; Multichip modules; Process control; Very large scale integration; Wires;
Conference_Titel :
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7789-9
DOI :
10.1109/MCMC.1997.569355
