DocumentCode
2197204
Title
Intrinsic area array ICs: what, why, and how
Author
Dehkordi, Peyman ; Tan, Chandra ; Bouldin, Donald
Author_Institution
Dept. of Electr. Eng., Tennessee Univ., Knoxville, TN, USA
fYear
1997
fDate
4-5 Feb 1997
Firstpage
120
Lastpage
124
Abstract
Area-array bonding technology (i.e. flip-chip, C4) was pioneered by IBM in the late 1960´s as an alternative to periphery bonding technology (i.e. wire-bond). In recent years, several commercial companies have started offering bumping and flip-chip services. Flip-chip technology is expected to grow at at compound annual growth rate of 38% through the year 2001. The purpose of this paper is to address the IC design issues and alternatives that are presently being used for area-array bonding technology and show the impact of these design issues at the system level
Keywords
flip-chip devices; integrated circuit design; microassembling; multichip modules; C4 bonding; IC design; area-array bonding technology; flip-chip technology; intrinsic area array ICs; Assembly; Bonding; Costs; Flip chip; Integrated circuit packaging; Manufacturing; Multichip modules; Process control; Very large scale integration; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-7789-9
Type
conf
DOI
10.1109/MCMC.1997.569355
Filename
569355
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