Title :
Wafer FAB exhaust management strategies
Author_Institution :
Sherer Consulting Services, Inc., Gilbert, AZ
Abstract :
Many wafer fabs have exhaust management challenges, which includes point-of-use (POU) abatement device decisions. Initially it is important to summarize general rules for exhaust management and POU abatement devices in a wafer fab, which can assist when developing solutions. Wafer fabs that have a fab exhaust management strategy provide a consistent approach to selecting best POU abatement devices and determining exhaust management practices. The fab exhaust management strategy is used to develop a process-specific exhaust management plan
Keywords :
integrated circuit manufacture; production management; exhaust management; point of use abatement; wafer fabrication; Chemistry; Corrosion; Costs; Documentation; Exhaust systems; Gases; Nitrogen; Personnel; Semiconductor materials; Technology management;
Conference_Titel :
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0351-0
DOI :
10.1109/ISEE.2006.1650073
